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HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

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City:zhengzhou

Province/State:henan

Country/Region:china

Contact Person:Daniel

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China Bump suction cup processing wholesale

Bump suction cup processing

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Brand Name :ZG

Model Number :MS

Certification :CE

Place of Origin :China

MOQ :1 PC

Price :10USD/PC

Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability :1000 PCS

Delivery Time :5-8 work days

Packaging Details :Strong wooden box for Global shipping

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Bump Suction Cupprocessing

Bumped suction cups, featuring raised, textured surfaces, are manufactured via precision injection molding using specialized molds to create intricate patterns for enhanced grip, with features as small as 0.3mm and high flatness tolerances (up to 0.03mm). These, often Alumina or SiC-bsed, improve vacuum stability in industrial, medical, and consumer electronics applications.

Key Aspects of Bump Suction Cup Processing:

Manufacturing Method: The suction cup main body is created by injecting synthetic resin into a cavity within a primary mold, allowing for customized surface textures.
Design Features: The bump structures are engineered to reduce contact area, enhancing anti-static properties, increasing wear resistance, and improving stability, particularly for handling delicate materials like wafers.
Materials & Performance: Materials include advanced ceramics like Alumina, which can be coated with Diamond-Like Carbon (DLC), or materials offering high, customizable flatness (down to 1um some cases)
$Maintenance: Performance is maintained by avoiding excessive heat or chemical exposure and ensuring the surfaces remain clean.$

Restoring Suction Cup Functionality:
If a suction cup loses its grip, it can be rejuvenated by boiling it for 2 to 5 minutes to restore its shape and elasticity, then allowing it to cool. Cleaning with warm water and soap also removes dirt that hinders suction.

Parameter	indicator	Maximum sintering size
Application	Wafer inspection, photolithography, etc.	Diameter 400, height 500
Bump Diameter (Minimum)	0.2mm	Diameter 400, height 40
Flatness(≤φ350mm)	300mm
Parallelism	≤3um
Maximum panel size	≤350mm
Materials	Silicon carbide, silicon nitride, aluminum nitride, aluminum oxide

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