HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Manufacturer from China
Verified Supplier
5 Years
Home / Products / Abrasive Media /

GRINDING BODIES USED IN BALL MILLS, BEAD MILLS, FOR FINE GRINDING,ZIRCONIA (ZRO2), ALUMINA (AL2O3), SILICON CARBIDE

Contact Now
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
Visit Website
City:zhengzhou
Province/State:henan
Country/Region:china
Contact Person:Daniel
Contact Now

GRINDING BODIES USED IN BALL MILLS, BEAD MILLS, FOR FINE GRINDING,ZIRCONIA (ZRO2), ALUMINA (AL2O3), SILICON CARBIDE

Ask Latest Price
Video Channel
Brand Name :ZG
Model Number :MS
Certification :CE
Place of Origin :CHINA
MOQ :1 piece
Price :USD10/piece
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :10000 pieces
Delivery Time :5-8 working days
Packaging Details :Strong wooden box for Global shipping
Material :Industrial ceramic
Size :Customized
Features :wear resistant
Color :White,Black
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

Grinding bodies used in ball mills, bead mills, for fine grinding

Grinding bodies of various shapes and compositions are used in ball mills, bead mills, agitators, attritors for fine or ultra-fine grinding, as well as for grinding and polishing.

Related Data

Main component 99%Al2O3 S-SiC ZrO2 Si3N4
Physical
Property
Density g/cm3 3.9 3.1 6 3.2
Water Absorption % 0 0.1 0 0.1
Sinter Temperature °C 1700 2200 1500 1800
Mechanical
Property
Rockwell Hardness HV 1700 2200 1300 1400
Bend Strength kgf/mm2 3500 4000 9000 7000
Compression Intensity Kgf/mm2 30000 20000 20000 23000
Thermal
Property
Maximum working
temperature
°C 1500 1600 1300 1400
thermal expansion
coefficient
0-1000°C
/°C 8.0*10-6 4.1*10-6(0-500°C) 9.5*10-6 2.0*10-6(0-500°C)
5.2*10-6(500-1000°C) 4.0*10-6(500-1000°C)
Thermal Shock resistance T(°C) 200 250 300 400-500
Thermal Conductivity W/m.k(25°C 31 100 3 25
300°C) 16 100 3 25
Electrical
Property
Resisting rate of Volume ◎.cm        
20°C >1012 106-108 >1010 >1011
100°C 1012-1013 >1011
300°C >1012 >1011
Insulation Breakdown
Intensity
KV/mm 18 semiconductor 9 17.7
Dielectric Constant (1 MHz) (E) 10 29 7
Dielectric Dissipation (tg o) 0.4*10-3

Main applications:

  • mining industry;

  • production of technical ceramics (piezo ceramics, insulators, electronic components, etc.);

  • production of sanitary ceramics;

  • production of paints, pigments, coatings, glazes, inks;

  • production of quartz sand;

  • production of fine calcium carbonate (GCC);

  • production of cement;

  • production of fertilizers;

  • food, cosmetics, pharmaceuticals.

Basic materials:

  • Zirconia (ZrO2), alumina (Al2O3), silicon carbide (SiC), silicon nitride (Si3N4), hard alloy.
  • Grinding balls of alumina (90-92%Al2O3, 98-99,7%Al2O3)
  • Beads (grinding microspheres) of alumina (90-92%Al2O3, 98-99.7%Al2O3)

Main advantages:

  • excellent strength;

  • excellent wear resistance;

  • high density;

  • close size distribution and smooth surface;

  • optimum results when processing high-viscosity materials.

Grinding balls of zirconia (partially stabilized with Y2O3 or CeO2)

Beads (grinding microspheres) from zirconium dioxide (partially stabilized with Y2O3)

It is widely used in high-speed vertical and horizontal mills.

Recommended for use with high-speed micro-fine wet grinding.

GRINDING BODIES USED IN BALL MILLS, BEAD MILLS, FOR FINE GRINDING,ZIRCONIA (ZRO2), ALUMINA (AL2O3), SILICON CARBIDEGRINDING BODIES USED IN BALL MILLS, BEAD MILLS, FOR FINE GRINDING,ZIRCONIA (ZRO2), ALUMINA (AL2O3), SILICON CARBIDEGRINDING BODIES USED IN BALL MILLS, BEAD MILLS, FOR FINE GRINDING,ZIRCONIA (ZRO2), ALUMINA (AL2O3), SILICON CARBIDE

Inquiry Cart 0