HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
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Sputter Target for Pulsed Laser Deposition ( PLD ) systems and DC or RF Magnetron Sputtering Systems
We provides a wide range of sputter target including Metal , Alloy , Rare earth , Single crystal , Compound , and various ceramic target , such as Oxide , Nitride , Carbide , Boride , Sulfide , Selenide and Telluride sputter target .We provide a complete line of sputtering target materials suitable for Pulsed Laser Deposition ( PLD ) systems and DC or RF Magnetron Sputtering Systems , These targets can be fabricated to fit all sputtering systems including round , rectangular , S-Gun , Delta , and Ring . Sputter target can be fabricated in round or square shape , with back plate or without back plate depands on the sputtering system and target material you have , our standard size from 1" to 12 " in diameter , thickness range from 1 mm , 3 mm to 6 mm , in single or multiple-piece construction . In addition , we can offer custom specifications designed to your unique needs including , dimension , thickness , purity , density , uniform grain size , composition rate , and different back plate . We have various sputter targets in stock and can machine to your specification with good quality . Contact us for more information .
| Manufacture Method | Application field |
|---|---|
| Vacuum hot pressing | Semiconductor |
| Hot isostatic pressing | Data storage |
| Cold isostatic pressing | Optoelectronics |
| Vacuum sintering | Flat panel display |
| Vacuum arc melting | Solar cell |
| Purity | 99.9% / 99.99% / 99.999% |
|---|---|
| Diameter | Ø 1" / Ø 2" / Ø 3" / Ø 4"/ Ø 6" / Ø 8" |
| Thickness | 3 mm ~ 6 mm |
| Back plate | OFHC copper |
| Bonding | Indium / Ag epoxy |
| Package | Vacuum sealed |
1. Boride Sputter Target
CrB, FeB, HfB2, LaB6, MgB2, Mo2B5 ,NbB, SmB6, TaB, TiB2, WB, VB, VB2, ZrB2
2. Carbide Sputter Target
B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, TiCN, VC, WC, VC, ZrC
3. Fluoride Sputter Target
BaF2, CaF2, CeF3, FeF2, KF, LaF3, PbF2, MgF2, NaF
4. Nitride Sputter Target
AlN, BN, CrN, GaN, HfN, InN, NbN, NbCrN, Si3N4, TaN, TiN, VN, ZnN, ZrN, ZrCN
5. Oxide Sputter Target
Al2O3, ATO, AZO, BaTiO3, BSCCO, BST, CeO2, CuO, Cr2O3,Fe2O3, HfO2, In2O3, ITO, IZO, IZGO, IZTO, LaAl2O3, LaSrMnO3, LiNbO3, MgO, MoO3, NiO, Nb2O5, PbTiO3, PZT, Sb2O3, SiO, SiO2, SnO2, SrRuO3, SrTiO3, Ta2O5, TiO2, SnO2, V2O5, WO3, Y2O3, Yb2O3, YBCO, YSZ, ZnO, ZAO, ZGO, ZIO, ZTO
6. Selenide Sputter Target
Al2Se3, Bi2Se3, CdSe, CuSe, Cu2Se, FeSe2, GeSe, In2Se3, MoSe2, MnSe, NbSe2, PbSe, Sb2Se3, SnSe, TaSe2, WSe2, ZnSe
7. Silicide Sputter Target
CoSi2, CrSi2, FeSi2, HfSi2, MoSi2, NbSi2, NiSi2, TaSi2, TiSi2, WSi2, VSi2, ZrSi2
8. Sulphide Sputter Target
CdS, CuS, Cu2S, FeS2, GaS, GeS, In2S3, PbS, MoS2, NiS, TiS2, Sb2S3, SnS, WS2, ZnS
9. Telluride Sputter Target
Al2Te3, Bi2Te3, CdTe, CuTe, GaTe, Ga2Te3, GeTe, PbTe, MnTe, MoTe2, NbTe2, TaTe2, SbTe, SnTe, WTe2, ZnTe