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HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

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The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

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China The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch wholesale
  • China The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch wholesale
  • China The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch wholesale
  • China The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch wholesale
  • China The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch wholesale

The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch
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Brand Name :ZG
Model Number :MS
Certification :CE
Place of Origin :CHINA
MOQ :1 piece
Price :USD10/piece
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :10000 pieces per month
Delivery Time :3 working days
Packaging Details :Strong wooden box for Global shipping
Application :fine chemical industry, pharmaceutical industry, environmental protection engineering
Dimension :the maximum diameter of tube bundle block can reach 200mm, and the height can be 500mm.
Material :Silicon carbide
Color :Black
Product name :silicon carbide tube bundle block
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SiC ICP Tray

Silicon carbide ICP tray is formed by isostatic pressing process and sintering at high temperature. The outer diameter, thickness, number and size of acupoints, position and shape of the tablet groove can also be finished according to the requirements of the user's design drawings to meet the specific requirements of the user.

Typical applications
  • The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etching.
Features and advantages
  • Good thermal conductivity, low coefficient of expansion and temperature uniformity
  • Plasma impact resistance
  • Can be made according to the specific size requirements of customers, the maximum diameter can reach 495MM
  • Resistant to all kinds of strong acid and alkali chemical reagent corrosion
Specifications:Diameter 330/380mm
The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch
Product Tags:

silicon wafer preparation

led extrusion profiles

led aluminium extrusion profiles
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